New QForm version at Forge Fair 2017

A new version of QForm will be presented at the Forging Industry Association’s Forge Fair 2017 at the Cleveland Convention Center, Cleveland, Ohio USA. Forge Fair is North America’s largest event dedicated exclusively to the forging industry and more than 1,500 forging professionals from across the globe are expected to attend this year.

Our booth is 940

Announce of some of new possibilities and improvements:

  • QForm heat treatment simulation module
  • electrical upsetting simulation
  • special module for rolling processes simulation
  • automated generation of technical reports
  • new model for die fatigue life analysis
  • Gartfield unique method for surface flow defects prediction.